Ansys Products 2022 R1新功能+教程

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Ansys Products 2022 R1: New Features and Enhanced Technological Innovations

Introduction

The Ansys suite of products in version 2022 R1 introduces a suite of advancements aimed at enhancing simulation capabilities for engineers and researchers in various industries. This article delves into the specific innovations, focusing on Ansys Mechanical, Ansys Fluent, Ansys Maxwell, Ansys Lumerical, Ansys Discovery, Ansys medini analysis, and electronic and mechanical engineering solutions. The updates are designed to improve the efficiency, quality of model building, performance, and accessibility, supporting broader, more complex simulations and analytical tasks.

Ansys Mechanical 2022 R1: Novel Enhancements and Scripting Capabilities

Key Features:




1. Scripting for Unlimited Model Building: Users now leverage Python scripts directly within the Ansys Mechanical interface. This capability significantly boosts the potential for customizing models and automating repetitive tasks, enhancing productivity and accuracy.

2. Adaptive Meshing for Shell Elements: Enhanced mesh quality and efficiency are achieved through a refined method for segmentbased analyses, which can reduce model size and operation time by up to 50 times.

3. Dynamic Analysis for Enhanced Accuracy: The introduction of multilevel, cyclesymmetric analyses optimizes simulation scenarios where multiple equivalent symmetrically arranged segments are involved, saving considerable time without compromising precision.

4. Simulation of Thermal Convection and Advanced Methodologies: LSDYNA integration with Smooth Particle Hydrodynamics (SPH), Arbitrary Lagrangian Eulerian (ALE), and implicit/explicit solutions is further augmented, offering support for complex simulations such as prestress loading and restart procedures for drop tests.

Ansys Fluent 2022 R1: Accelerated Computational Fluid Dynamics

Key Features:

1. HighFidelity CFD at High Speeds: Simulations capable of up to 30 Mach velocities are optimized by a factor of up to 5 times, significantly advancing capabilities in highspeed flow simulations. The handling of reaction sources in densitybased solvers is also enhanced.

2. Wall Retraction Workflow: A new builtin process is introduced for simulating surface erosion, streamlining experiments and predictions related to surface burnoff in complex geometries.

3. Efficient Simulation of Burning and Multiphase Applications: The number of cells is reduced by up to 70%, improving computational efficiency without loss of detail for combustion processes and multiphase flows.

4. Enhanced Combustion Modeling and Emissions Prediction: Improved algorithms and validations confirm Ansys Fluent's capability in predicting Global Emissions such as Nitrogen Oxides (NOx) and Carbon Monoxide (CO).

5. Advanced Hydrogen and Hydrogen Blends Modeling: Capabilities have been expanded to include the simulation of hydrogenderived gases, enhancing safety and performance analysis in industries relying on hydrogen energy.

Ansys Maxwell 2022 R1: Advanced Electromagnetic Simulations and Multiscale Enhancements

Key Features:

1. Advanced EM Analysis: The Aphi solver in Maxwell is further optimized for transient multiconduction path simulations, enhancing the accuracy and efficiency of Electromagnetic Compatibility (EMC) analysis in critical systems like buses, power electronics, and multilayer PCBs.

2. Improved 2D Tilting Designs with Maxwell: The capability to define any threedimensional physical tilting topologies to 2D designs while maintaining 3D precision predictions, enabling more costeffective and scalable solutions for engineers.

3. Multidimensional Autofocusing in NVH Enhancements: This feature allows for precise characterization of dynamic behavior, offering a more nuanced understanding of nonlinear phenomena, which is crucial in automotive and aerospace applications.

4. Anisotropic Elastic Properties for Magnetic Strain Modeling: Improved models accurately capture the anisotropic nature of magnetic materials under stress, enhancing the reliability of simulations in magnetic applications.

Ansys Electronics Desktop: Innovation in Circuit and Electronics Simulation and Optimization

Key Features:

1. Advanced Simulation Capabilities: From native Joule heating to improved MCAD geometry processing, enhanced meshing, and solution methodologies, Icepak accelerates the electronic heat management analysis, streamlining the simulation workflow and reducing processing times by orders of magnitude.

2. Integration with Ansys Electronics Desktop: Improved connectivity allows for seamless simulation preparations, material selection, and presimulation workflows, directly synchronized between Ansys Mechanical, Ansys Fluent, and other Ansys products.

3. OptiSLang Integration: The introduction of OptiSLang's highperformance components, including advanced and enterprise licensing options and a tighter integration with Ansys Electronics Desktop, empowers engineers to tap into sophisticated optimization routines and workflows directly from the solver environment.

Ansys Lumerical: Pioneering Photonics Simulation Innovations

Key Features:

1. Improved MQW Gain Solvers: Advanced features such as exciton modeling for enhanced simulation in the electrical simulation, and the ability to carry out simulations directly from the GUI in the finite element IDE, significantly improve accuracy and simulation speed.

2. Support for Optical Sparameters in Touchstone Format: Compatibility with Touchstone for importing/exporting optical Sparameters accelerates the workflow across different Ansys components.

3. Enhanced FDTD, MODE, and INTERCONNECT Support: FDTD solvers, MODE optical simulator, and INTERCONNECT now offer an improved interface for Touchstone files, streamlining electrical simulation workflows.

4. PML Boundary Conditions and Workflows: Features like Perfectly Matched Layer (PML) boundary conditions improve the fidelity of electromagnetic simulations.

5. OptiSLang Integration and Enhanced Collaboration: Seamless integration with Ansys Lumerical, along with the introduction of additional tools and models, accelerates the simulation process and enables advanced photonic design optimizations.

Ansys Discovery: Expanding Simulation Accessibility and Easeofuse

Key Features:

1. Predictive Simulation Capabilities: Highfidelity simulations of physical phenomena like idealized sliding contact and multiscale applications such as gaps in porous materials are streamlined, allowing for faster and simplified modeling tasks.

2. Seamless Workbench Integration: Discovery now tightly integrates with Ansys Workbench, enabling analysts to link CAD production data, execute presimulation tasks, and transfer data between Ansys Mechanical, Ansys Fluent, and other Workbench applications without leaving the Ansys environment.

Ansys medini Analysis: Streamlining Safety and Reliability Analysis

Key Features:

1. Advanced Analysis Capabilities: A comprehensive suite of tools aimed at reducing analysis time and effort, now supported with modern and robust methodologies for safety, reliability, and network analysis.

2. DSM Tool: This novel product within the Analysis suite offers advanced solutions for managing and advancing safetyrelated activities, providing an integrated platform for safety calculations and analysis workflow optimization.

Ansys SpaceClaim: Enhancing CADbased Engineering Capabilities

Key Features:

1. Core Improvements for Sheet Metal and Reverse Engineering: These enhancements bolster the software's capabilities in CADbased engineering, particularly for operations in sheet metal design and highfidelity digital representation of scanned models.

2. Automated Modeling Workflows: Leveraging the enhanced SpaceClaim for triggering CADbased engineering workflows, including linked CAD interfaces, historical tracking, and constraintdriven sketching, facilitates a seamless transition from CAD data to simulation input.

New Ansys OptiSLang Licenses and Integration Enhancements

Key Features:

1. Flexible Licensing Options: New categories for advanced and enterpriselevel users offer a more tailored licensing experience, aligning better with individual and organizational requirements.

2. Enhanced Integration with Ansys Workflow Tools: Improvements in the AEDT LSDSO and other advanced tools support a more streamlined, cohesive workflow between OptiSLang and the Ansys Electronics Desktop, enabling direct simulation and optimization from the familiar AEDT interface.

3. Automation and Acceleration: Tools like the 'Saved Scenarios' feature and the ability to suppress physical conditions in simulation setups, coupled with connections to other Ansys solutions like Ansys Granta Selector and Ansys MI, facilitate faster setuptoreport generation cycles without compromising on accuracy.

Ansys Icepak: Transformed Thermal Management Simulation

Key Features:

1. Enhanced Joule Heating Analysis: Direct solutions for closelycoupled electricthermal problems involving static or transient excitation systems, improving the fidelity of laser heating simulations.

2. Reduced Overhead for Setup: Simplified configurations for multiload levels and flow textures in a simulation environment, significantly cutting the setup time for complex scenarios.

3. Optimized Processing Times: Processing times are up to 10 to 100 times faster with improved Icepak solvers, leveraging advanced geometries, meshing strategies, and initialization techniques in MCAD contexts.

Ansys Granta MI: Improved Material Data Management

Key Features:

1. Enhanced User Interface and Integration: Enhanced accessibility and user convenience through a refined interface that works seamlessly with a variety of engineering tools, streamlining material data management processes.

2. Advanced Material Data Access: With faster and more convenient access to fundamental, credible material data, Simulations users can more effectively manage their material information within the Granta MI framework.

3. IndustryFocused Material Data Libraries: Access to the latest and most relevant material data specifically tailored for industries such as aerospace, automotive, energy, and semiconductors.

This article encapsulates the technological advancements embedded within Ansys Products 2022 R1, showcasing the evolution in simulation capabilities, workflow optimization, and enhanced modelbuilding potential across various engineering applications. These improvements collectively represent a significant leap in optimizing the simulation process, paving the way for more advanced and efficient engineering practices across diverse industries.


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